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Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements

著者名:
掲載資料名:
Microelectronic Yield, Reliability, and Advanced Packaging
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4229
発行年:
2000
開始ページ:
157
終了ページ:
167
総ページ数:
11
出版情報:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819439017 [0819439010]
言語:
英語
請求記号:
P63600/4229
資料種別:
国際会議録

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