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"Two-Layer, Planar, Superconducting Multichip Module Technology"

著者名:
Brown,W.D.
Ang,S.S.
Chan,F.T.
Luo,W.A.
Salamo,G.J.
Yao,H.J.
Zhang,G.
Cooksey,J.W.
さらに 3 件
掲載資料名:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4217
発行年:
2000
開始ページ:
226
終了ページ:
231
総ページ数:
6
出版情報:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
言語:
英語
請求記号:
P63600/4217
資料種別:
国際会議録

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8 国際会議録 High .c Tl-Based Superconducting Thin Films

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3 国際会議録 Low-cost flexible ball-grid-array multichip module technology

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9 国際会議録 Large Area CVD of Diamond Film for Multichip Modules

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4 国際会議録 Investigation of Wirebonds on Insulated-Metal Substrate for Multichip Power Module Applications

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10 国際会議録 The Seamless High Off-Chip Connectivitity (SHOCC) Packaging Technology

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