Blank Cover Image

Modeling of the removal rate in chemical mechanical polishing

著者名:
掲載資料名:
Challenges in process integration and device technology : 18-19 September 2000, Santa Clara, USA
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4181
発行年:
2000
開始ページ:
161
終了ページ:
167
総ページ数:
7
出版情報:
Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819438423 [0819438421]
言語:
英語
請求記号:
P63600/4181
資料種別:
国際会議録

類似資料:

1 国際会議録 A Theoretical Model for Chemical-Mechanical Polishing of Blanket Wafers with Soft Pads

Shi, F.G., Zhao, B.

Electrochemical Society
7 国際会議録 Chemical Mechanical Polishing on Extremely Low Expansion Glass Ceramic Wafers

Z.F. Shi, Z.Y. Zhang, S.L. Huang, B.Y. Yuan, X.G. Guo, P. Zhou, Z.J. Jin

Trans Tech Publications
2 国際会議録 *CHEMICAL MECHANICAL POLISHING OF INTERLEVEL DIELECTRICS: MODELS FOR REMOVAL RATE AND PLANARITY

Sivaram,. S., Tolles, R., Bath, H., Lee, E., Leggett

Materials Research Society
8 国際会議録 The Effect of Slurry Composition and Flatness on Sub-Surface Damage and Removal in Chemical Mechanical Polishing of 6H-SiC

G.S. Lee, H.H. Hwang, C.H. Son, J.W. Choi, W.J. Lee

Trans Tech Publications
3 国際会議録 Removal Rate, Uniformity and Defectivity Studies Of Chemical Mechanical Polishing of BPSG Films

Bonner, B.A., Fishkin, B., David, J., Garretson, C., Osterheld, T.H.

Materials Research Society
9 国際会議録 Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X., Guo, D. M., Kang, R. K., Jin, Z. J., Li, X. J., Tian, Y. B.

Trans Tech Publications
4 国際会議録 Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films

Bonner, Benjamin A., Fishkin, Boris, David, Jeffrey, Garretson, Chad, Osterheld, Thomas H.

Materials Research Society
10 国際会議録 Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers

Lee, J.M., Cho, S.H., Park, J.G., Lee, S.H., Han, Y.P., Kim, S.Y.

SPIE-The International Society for Optical Engineering
5 国際会議録 Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

J.H. An, G.S. Lee, W.J. Lee, B.C. Shin, J.D. Seo

Trans Tech Publications
11 国際会議録 A Model of Chemical Mechanical Polishing

Paul, Ed

Materials Research Society
6 国際会議録 Tuning the Removal Rate of Carbon Doped Oxide during Chemical Mechanical Polishing

Z. Liu, J. Bian

Electrochemical Society
12 国際会議録 CHARACTERIZATION OF CHEMICAL-MECHANICAL POLISHING DIELECTRICS FOR MULTILEVEL METALLIZATION

Sun, S. C., Yeh, F. L., Tien, H. Z.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12