Composite Materials With Adjustable Thermal Expansion for Electronic Applications
- 著者名:
- 掲載資料名:
- Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 445
- 発行年:
- 1997
- 開始ページ:
- 229
- 出版情報:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993495 [1558993495]
- 言語:
- 英語
- 請求記号:
- M23500/445
- 資料種別:
- 国際会議録
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