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Spalling of Cu-Sn Compound Spheroids in Solder Joints on Si Wafers

著者名:
掲載資料名:
Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
445
発行年:
1997
開始ページ:
27
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993495 [1558993495]
言語:
英語
請求記号:
M23500/445
資料種別:
国際会議録

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