Evaluation of Epoxy Underfill Materials for Use in ""Chip-on-Board"" Method of Packaging Silicon Integrated Circuits
- 著者名:
- Park E. C. ( Pohang University of Science and Technology )
- Raju R. V. ( AT&T Bell Labs )
- Bair E. H. ( AT&T Bell Labs )
- Han J. B. ( AT&T Bell Labs )
- 掲載資料名:
- ANTEC 95, Boston, May 7-11, Boston : The plastics challenge - a revolution in education : Volume II. Materials
- シリーズ名:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- シリーズ巻号:
- 41(2)
- 発行年:
- 1995
- 巻:
- 2
- 開始ページ:
- 2871
- 終了ページ:
- 2876
- 総ページ数:
- 6
- 出版情報:
- Brookfield, CT: Society of Plastics Engineers, Inc. (SPE)
- ISBN:
- 9781566763196 [1566763193]
- 言語:
- 英語
- 請求記号:
- S42700/962602
- 資料種別:
- 国際会議録
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10
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