Evaluation of Epoxy Underfill Materials for Use in "Chip-on-Board" Method of Packaging Silicon Integrated Circuits

Evaluation of Epoxy Underfill Materials for Use in "Chip-on-Board" Method of Packaging Silicon Integrated Circuits

著者名:

Park E. C. ( University of Science and Technology )
Raju R. V. ( AT&T Bell Labs )
Bair E. H. ( AT&T Bell Labs )
Han J. B. ( AT&T Bell Labs )

掲載資料名:

ANTEC 95, Boston, May 7-11, Boston : The plastics challenge - a revolution in education : Volume II. Materials

シリーズ名:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

シリーズ巻号:

41(2)

発行年:

1995

巻:

2

開始ページ:

2871

終了ページ:

2876

総ページ数:

6

出版情報:

Brookfield, CT: Society of Plastics Engineers, Inc. (SPE)

ISBN:

9781566763196 [1566763193]

言語:

英語

請求記号:

S42700/962602

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00020624
シリーズID:	PA00000030
会議名:	ANTEC '95 : Annual Technical Conference
回次:	53rd
会議開催地:	Boston, MA, USA
会議開催年:	1995.05.07-1995.05.11
論文注記:	ENGINEERING PROPERTIES & STRUCTURE JOIT WITH ELECTRICAL & ELECTRONIC DIVISION

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1 国際会議録 Evaluation of Epoxy Underfill Materials for Use in ""Chip-on-Board"" Method of Packaging Silicon Integrated Circuits Park E. C., Raju R. V., Bair E. H., Han J. B. Society of Plastics Engineers, Inc. (SPE)	7 国際会議録 Stereolithography Inserts-""Pros"" and ""Cons"" to Use Tin as a Backfilling Material Ferreira, A. C., Ahrens, C. H., Lafratta, F. H., Gomide, R. B. Society of Plastics Engineers, Inc. (SPE)
2 国際会議録 Expansion Behavior of Epoxy Encapsulated Integrated Circuits Bair, H. E., Boyle, D. J., Steiner, K. G., Young, A. L. Society of Plastics Engineers, Inc. (SPE)	8 国際会議録 Board Level Reliability of Chip Scale Packages Hung,Sung-Ching, Zheng,P.J., Chen,H.N., Lee,S.C., Lee,J.J. SPIE - The International Society for Optical Engineering
3 国際会議録 Experimental Study for Underfill of Flip Chip Packages Jong, W-R., Chen, S., Lai, C., Tsai, H., Liu, H., Ho, S., Lo, W-Y. Society of Plastics Engineers	9 国際会議録 Microring and microdisk resonator integrated circuits on a silicon chip A. W. Poon, L. Zhou, C. Li, N. K. Hon, H. Chen SPIE - The International Society of Optical Engineering
4 国際会議録 Molding Analysis for Underfill of Flip-Chip Packages Jong, W.R., Chen, S.C., Lai, C.C., Kuo, T.H., Liu, H.W., Ho, S., Lo, W.Y. Society of Plastics Engineers	10 国際会議録 Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test D.G. Kim, J.W. Kim, S.S. Ha, J.M. Koo, B.I. Noh, S.B. Jung Trans Tech Publications
5 国際会議録 Cure Kinetics of Advanced Flip-Chip Underfill Materials Hsu, D.I., Kim, H.K., Shi, F.G., Chungpaiboonpatana, S., Davidson, C., Adams, J.M. Electrochemical Society	11 国際会議録 Integrated silicon photonic circuit: monolithic 8-channel modulator, tap, vertical coupler, and flip-chip mounted photodetector array [6125-16] Smith, B. T., Lei, H., Kung, C.-C., Feng, D., Yin, J., Liang, H. SPIE - The International Society of Optical Engineering
6 テクニカルペーパー Effect of underfill on deformations of surface laminar circuit in flip chip package Kunthong, P., Han, B. The American Society of Mechanical Engineers	12 国際会議録 Microfabricated Direct Methanol Fuel Cells to Power On-Board Integrated Circuits Raitner, M., Mak, C., Merry, W.K., Guenther, R., Chinn, J.D., Lin, Y.-C., Jen, C.-R., Wu, W.-D., Yang, C.-C., Ho, H.-C., … Electrochemical Society

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