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Characterization of low temperature, wafer-level gold-gold thermocompression bonds

著者名:
掲載資料名:
Materials science of microelectromechanical systems (MEMS) devices II : symposium held November 29-December 1, 1999, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
605
発行年:
2000
開始ページ:
171
出版情報:
Warrendale, Pa.: MRS-Materials Research Society
ISSN:
02729172
ISBN:
9781558995130 [1558995137]
言語:
英語
請求記号:
M23500/605
資料種別:
国際会議録

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