Modelling of Failure in Metallic Thin Films Induced By Stress and Electromigration: A Multiscale Computational Analysis

Modelling of Failure in Metallic Thin Films Induced By Stress and Electromigration: A Multiscale Computational Analysis

著者名:

掲載資料名:

Multiscale modelling of materials : symposium held November 30-December 3, 1998, Boston, Massachusets, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

538

発行年:

1999

開始ページ:

263

出版情報:

Warrendale, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994447 [1558994440]

言語:

英語

請求記号:

M23500/538

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00020316
シリーズID:	PA00000011
会議名:	Symposium on multiscale modelling of materials
回次:	1998
会議開催地:	Boston, MA, USA
会議開催年:	1998.11.30-1998.12.03

類似資料:

1 国際会議録 Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects Maroudas, D., Gungor, R., Ho, H., Gray, L. Electrochemical Society	7 国際会議録 Analysis of Electromigration-Driven Interactions between Voids in Metallic Thin Films Jaeseol Cho, M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers
2 国際会議録 Analysis of Failure in Metallic Thin-Film Interconnects Due to Stress and Electromigration-Induced Void Propagation Gungor, M. Rauf, Gray, Leonard J., Maroudas, Dimitrios MRS - Materials Research Society	8 国際会議録 564c. Effects of Elastic Stress on Electromigration-Driven Void Dynamics in Metallic Thin Films M. Rauf Gungor, Vivek Tomar, Dimitrios Maroudas American Institute of Chemical Engineers
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4 国際会議録 Analysis of Electromigration-Induced Void Motion and Surface Oscillation in Metallic Thin-Film Interconnects Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios Materials Research Society	10 国際会議録 Atomic-Scale Analysis of Strain Relaxation Mechanisms in Ultra-Thin Metallic Films Rauf Gungor, M., Maroudas, Dimitrios Materials Research Society
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