Use of Malonic Acid in Chemical Mechanical Polishing (CMP) of Tungsten
- 著者名:
- 掲載資料名:
- Science and technology of semiconductor surface preparation : symposium held April 1-3, 1997, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 477
- 発行年:
- 1997
- 開始ページ:
- 115
- 出版情報:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993815 [1558993819]
- 言語:
- 英語
- 請求記号:
- M23500/477
- 資料種別:
- 国際会議録
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