Direct Observation of the Effects of Cu Distribution on Electromigration Phenomena in Submicron Al Interconnects

Direct Observation of the Effects of Cu Distribution on Electromigration Phenomena in Submicron Al Interconnects

著者名:

掲載資料名:

Polycrystalline thin films II : structure, properties, and applications : symposium held November 27-December 1, 1995, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

403

発行年:

1996

開始ページ:

651

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993068 [1558993061]

言語:

英語

請求記号:

M23500/403

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00020303
シリーズID:	PA00000011
会議名:	Symposium on polycrystalline thin films
回次:	2nd
会議開催地:	Boston, MA, USA
会議開催年:	1995.11.27-1995.12.01

類似資料:

1 国際会議録 In Situ Study of Al2Cu Precipitate Evolution During Electromigration in Submicron Al Interconnects Theiss, Silva K., Prybyla, J. A. MRS - Materials Research Society	7 国際会議録 Electromigration In Submicron Dual-Damascene Cu/Low-K Interconnects Lee, Ki-Don, Lu, Xia, Ogawa, Ennis T., Matsuhashi, Hideki, Blaschke, Volker A., Augur, Rod, Ho, Paul S. Materials Research Society
2 国際会議録 The Effect of Cu Concentration and Distribution on the Lifetimes of Submicron, Bamboo Al(Cu) Runners Theiss, Silva K., Prybyla, J. A., Marcus, M. A. MRS - Materials Research Society	8 国際会議録 Effect of Ar Sputtering Pretreatment on the Electromigration Resistance in Al-Cu/TiN/Ti Interconnects Wang, L. P., Chuang, A., Lin, L. T., Huang, F. S., Perng, K., Hwang, J. MRS - Materials Research Society
3 国際会議録 MICROSTRUCTURE AND ELECTROMIGRATION PROPERTIES OF SUBMICRON Al(.5%Cu) LINES Prybyla, J. A., Kola, R. R., Hull, R., Eaglesham, D. J., Huggins, H. A. MRS - Materials Research Society	9 国際会議録 ELECTROMIGRATION IN Al/W AND Al(Cu)/W INTERCONNECT STRUCTURES Hu, C-K., Ho, P. S., Small, M. B., Kelleher, K. Materials Research Society
4 国際会議録 Real-Time TEM Studies of Electromigration in Submicron Aluminum Runners Riege, S. P., Hunt, A. W., Prybyla, J. A. MRS - Materials Research Society	10 国際会議録 Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects Shih, W. C., Greer, A. L. MRS - Materials Research Society
5 国際会議録 Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines Mirpuri, K. K., Szpunar, J. A. Trans Tech Publications	11 国際会議録 Length Effects On The Reliability Of Dual-Damascene Cu Interconnects Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., … Materials Research Society
6 国際会議録 Effects of Cu and Si Dopants on Electromigration Mass Transport in Al Interconnects for VLSI Lee, C. H., Fejes, P. L., York, B. R., Elwell, S. A., Carnes, R. O., Lee, J. Y., Grivna, G. M., Bauguess, S. W., Dreyer, … MRS - Materials Research Society	12 国際会議録 OBSERVATION AND MODELLING OF ELECTROMIGRATION-INDUCED VOID GROWTH IN Al-BASED INTERCONNECTS Kraft, O., Bader, S., Sanchez, J. E., Jr., Arzt, E. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12