Thin electroless barrier for copper films
- 著者名:
- Lopatin,S.D. ( Cornell Univ. )
- Shacham-Diamand,Y.Y. ( Cornell Univ. )
- Dubin,V.M. ( Cornell Univ. )
- Kim,Y.S. ( Cornell Univ. )
- Vasudev,P.K. ( SEMATECH )
- 掲載資料名:
- Multilevel Interconnect Technology II
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 3508
- 発行年:
- 1998
- 開始ページ:
- 65
- 終了ページ:
- 77
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819429674 [0819429678]
- 言語:
- 英語
- 請求記号:
- P63600/3508
- 資料種別:
- 国際会議録
類似資料:
SPIE-The International Society for Optical Engineering |
7
国際会議録
Interaction between the Electroless Copper Deposition Solution and the Low-k Fluorinated Dielectrics
Electrochemical Society |
2
国際会議録
Conformal Electroless Copper Deposition for sub-0.5 μm Interconnect Wiring of Very High Aspect Ratio
Electrochemical Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
9
国際会議録
Fabrication of the Electroless NiMoB Films as a Diffusion Barrier Layer on the Low-k Substrate
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |