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MICROSTRUCTURE, DAMAGE AND RESISTANCE DURING ELECTROMIGRATION LIFE-TESTING OF Al-Cu INTERCONNECTS

著者名:
掲載資料名:
Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
309
発行年:
1993
開始ページ:
369
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992054 [1558992057]
言語:
英語
請求記号:
M23500/309
資料種別:
国際会議録

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