Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
- 著者名:
Cohen, S. A. Liu, J. Gignac, L. Ivers, T. Armbrust, D. Rodbell, K. P. Gates, S. M. - 掲載資料名:
- Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 564
- 発行年:
- 1999
- 開始ページ:
- 551
- 出版情報:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994713 [1558994718]
- 言語:
- 英語
- 請求記号:
- M23500/564
- 資料種別:
- 国際会議録
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