Characterization of Plated Cu Thin Film Microstructures | 東京工業大学附属図書館文献データベース

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Characterization of Plated Cu Thin Film Microstructures

著者名:

Cabral, C., Jr.

Andricacos, P. C.

さらに 3 件

掲載資料名:

Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

564

発行年:

1999

開始ページ:

373

出版情報:

Warrendale, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994713 [1558994718]

言語:

英語

請求記号:

M23500/564

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019849
シリーズID:	PA00000011
会議名:	Symposium on advanced interconnects and contacts
回次:	1999
会議開催地:	San Francisco, CA, USA
会議開催年:	1999.04.05-1999.04.07

類似資料:

1 国際会議録 Characterization of Plated Cu Thin Film Microstructures Beyers, R. B., Cabral, C., Gignac, L. M., Klepeis, S. J., Locke, P. S., ricacos, P. C., Rice, P. M., Rodbell, K. P. Materials Research Society	7 国際会議録 KINETICS OF INTERMETALLIC FORMATION IN FREE STANDING Cu/Mg MULTILAYER THIN FILMS Arcot, B., Clevenger, L. A., Murarkar, S. P., Harper, J. M. E., Cabral Jr., C. Materials Research Society
2 国際会議録 Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films Harper, J. M. E., Cabral, C., Jr., Andricacos, P. C., Gignac, L., Noyan, I. C., Rodbell, K. P., Hu, C. K. MRS - Materials Research Society	8 国際会議録 Film Crystallographic Texture and Substrate Surface Roughness in Layered Aluminum Metallization Rodbell, K. P., Svilan, V., Gignac, L. M., DeHaven, P. W., Murphy, R. J., Licata, T. J. MRS - Materials Research Society
3 国際会議録 Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films Cabral, C., Gignac, L., Harper, J. N. E., Hu, C. K., Noyan, I. C., ricacos, P. C., Rodbell, K. P. Materials Research Society	9 国際会議録 Electrodes and Barriers for DRAM and FERAM: Processing, Integration, and Fundamentals Saenger, K.L., Andricacos, P.C., Athavale, S.D., Baniecki, J.D., Cabral, C., Jr., Costrini, G., Kwietniak, K.T., … Materials Research Society
4 国際会議録 Dopants in Electroplated Copper Andricacos, P.C., Parks, C., Cabral, C., Wachnik, R., Tsai, R., Maihotra, S., Locke, P., Fluegel, J., Horkans, J., … Electrochemical Society	10 国際会議録 Dependence of Crystallographic Texture of C54 TiSi2 on Thickness and Linewidth in Submicron CMOS Structures Svilan, V., Rodbell, K. P., Clevenger, L. A., Cabral, C., Jr., Roy, R. A., Lavoie, C., Jordan-Sweet, J., Harper, J. M. … MRS - Materials Research Society
5 国際会議録 Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep Cohen, S. A., Liu, J., Gignac, L., Ivers, T., Armbrust, D., Rodbell, K. P., Gates, S. M. MRS - Materials Research Society	11 国際会議録 Textures of Cu and Dilute Binary Cu(Ti) and Cu(In) Thin Films Gungor, A., Barmak, K., Rollett, A.D., Cabral Jr, C., Harper, J.M.E. Trans Tech Publications
6 国際会議録 Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep Armbrust, D., Cohen, S. A., Gates, S. M., Gignac, L., Ivers, T., Liu, J., Rodbell, K. P. Materials Research Society	12 国際会議録 Phase Formation in Cu(Sn) Alloy Thin Films Clevenger, L. A., Arcot, B., Ziegler, W., Colgan, E. G., Hong, Q. Z., d'Heurle, F. M., Cabral, C., Jr., Gallo, T. A., … MRS - Materials Research Society

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