Agglomeration of Cu Electroplating Seed Layers on Ultra-Thin Ta, Ta1-xNx, Ta1-xOx, Contaminated Ta, and Composite Ta/Ta1-xNx Diffusion Barriers

Agglomeration of Cu Electroplating Seed Layers on Ultra-Thin Ta, Ta1-xNx, Ta1-xOx, Contaminated Ta, and Composite Ta/Ta1-xNx Diffusion Barriers

著者名:

掲載資料名:

Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

564

発行年:

1999

開始ページ:

257

出版情報:

Warrendale, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994713 [1558994718]

言語:

英語

請求記号:

M23500/564

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019849
シリーズID:	PA00000011
会議名:	Symposium on advanced interconnects and contacts
回次:	1999
会議開催地:	San Francisco, CA, USA
会議開催年:	1999.04.05-1999.04.07

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