The Electromigration of CVD-Copper and PVD-Copper Polycrystalline Lines

The Electromigration of CVD-Copper and PVD-Copper Polycrystalline Lines

著者名:

掲載資料名:

Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

516

発行年:

1998

開始ページ:

281

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994225 [155899422X]

言語:

英語

請求記号:

M23500/516

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019845
シリーズID:	PA00000011
会議名:	Symposium on materials reliability in microelectronics
回次:	8th
会議開催地:	San Francisco, CA, USA
会議開催年:	1998.04.13-1998.04.16

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