Analysis of Failure in Metallic Thin-Film Interconnects Due to Stress and Electromigration-Induced Void Propagation

Analysis of Failure in Metallic Thin-Film Interconnects Due to Stress and Electromigration-Induced Void Propagation

著者名:

掲載資料名:

Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

516

発行年:

1998

開始ページ:

165

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994225 [155899422X]

言語:

英語

請求記号:

M23500/516

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019845
シリーズID:	PA00000011
会議名:	Symposium on materials reliability in microelectronics
回次:	8th
会議開催地:	San Francisco, CA, USA
会議開催年:	1998.04.13-1998.04.16

類似資料:

1 国際会議録 Thermal Processing and Failure Due to Current Driven Mass Transport of Metallic Thin Film Interconnects Gray, Leonard J., Gungor, Rauf, Maroudas, Dimitrios American Institute of Chemical Engineers	7 国際会議録 512a. Atomic-Scale Analysis of Ductile Void Growth and Nanocrystalline Domain Formation as Strain Relaxation Mechanisms in Ultra-Thin Metallic Films M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers
2 国際会議録 Analysis of Electromigration-Induced Void Motion and Surface Oscillation in Metallic Thin-Film Interconnects Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios Materials Research Society	8 国際会議録 Theoretical Analysis of Faceted Void Dynamics in Metallic Thin Films Under Electromigration Conditions Ho, Henry S., Gungor, M. Rauf, Maroudas, Dimitrios MRS - Materials Research Society
3 国際会議録 177a. Non-Linear Analysis of Electromigration-Induced Surface Waves on Voids in Metallic Thin Films Jaeseol Cho, M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers	9 国際会議録 Modelling of Failure in Metallic Thin Films Induced By Stress and Electromigration: A Multiscale Computational Analysis Gungor, M. R., Gray, L. J., Zhou, S. J., Maroudas, D. MRS - Materials Research Society
4 国際会議録 Analysis of Electromigration-Driven Interactions between Voids in Metallic Thin Films Jaeseol Cho, M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers	10 国際会議録 Atomic-Scale Analysis of Strain Relaxation Mechanisms in Ultra-Thin Metallic Films Rauf Gungor, M., Maroudas, Dimitrios Materials Research Society
5 国際会議録 564c. Effects of Elastic Stress on Electromigration-Driven Void Dynamics in Metallic Thin Films M. Rauf Gungor, Vivek Tomar, Dimitrios Maroudas American Institute of Chemical Engineers	11 国際会議録 433a. Electromechanically-Driven Complex Void Dynamics In Metallic Thin Films Vivek Tomar, M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers
6 国際会議録 Theoretical Analysis of Electromigration-Induced Failure of Metallic Thin Films Maroudas, Dimitrios, Gungor, M. Rauf, Ho, Henry S., Enmark, Matthew N. MRS - Materials Research Society	12 国際会議録 Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects Maroudas, D., Gungor, R., Ho, H., Gray, L. Electrochemical Society

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