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Effect of Ar Sputtering Pretreatment on the Electromigration Resistance in Al-Cu/TiN/Ti Interconnects

著者名:
Wang, L. P.
Chuang, A.
Lin, L. T.
Huang, F. S.
Perng, K.
Hwang, J.
さらに 1 件
掲載資料名:
Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
516
発行年:
1998
開始ページ:
103
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994225 [155899422X]
言語:
英語
請求記号:
M23500/516
資料種別:
国際会議録

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