Mold-Filling-Simulation in Injection Molding of Three-Dimensional Thin Parts
- 著者名:
- Wang W. V. ( Cornell University )
- Hieber A. C.
- Wang K. K.
- 掲載資料名:
- ANTEC 86, Boston, April 28-May 1, 1986 : "plastics - value through technology" : conference proceedings : Society of Plastics Engineers 44th annual technical conference & exhibit
- シリーズ名:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- シリーズ巻号:
- 32
- 発行年:
- 1986
- 開始ページ:
- 97
- 終了ページ:
- 102
- 総ページ数:
- 6
- 出版情報:
- Brookfield, CT: Society of Plastics Engineers, Inc. (SPE)
- 言語:
- 英語
- 請求記号:
- S42700/870319
- 資料種別:
- 国際会議録
類似資料:
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
3
国際会議録
Optimum Design of Process Conditions to Minimize Residual Stresses in Injection-Molded Parts
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers |
Society of Plastic Engineers. |