Optical pressure sensor head fabrication using ultrathin silicon wafer anodic bonding

Optical pressure sensor head fabrication using ultrathin silicon wafer anodic bonding

著者名:

Beggans,M.H. ( New Jersey Institute of Technology )
Ivanov,D.I.
Fu,S.G.
Digges,T.G.,Jr.
Farmer,V.K.R.

掲載資料名:

Design, test, and microfabrication of MEMS and MOEMS : 30 March-1 April 1999, Paris, France

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3680

発行年:

1999

巻:

Part2

開始ページ:

773

終了ページ:

782

出版情報:

Bellingham, Wash., USA: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819431547 [0819431540]

言語:

英語

請求記号:

P63600/3680

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019464
シリーズID:	PA00000029
会議名:	Design, test, and microfabrication of MEMS and MOEMS
回次:	1999
会議開催地:	Paris, France
会議開催年:	1999.03.30-1999.04.01

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