Blank Cover Image

Chip-level three-dimensional assembling of microsystems

著者名:
掲載資料名:
Design, test, and microfabrication of MEMS and MOEMS : 30 March-1 April 1999, Paris, France
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3680
発行年:
1999
巻:
Part2
開始ページ:
679
終了ページ:
686
出版情報:
Bellingham, Wash., USA: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819431547 [0819431540]
言語:
英語
請求記号:
P63600/3680
資料種別:
国際会議録

類似資料:

1 国際会議録 Three-dimensional liquid display

A. Chekhovskiy, H. Toshiyoshi

Society of Photo-optical Instrumentation Engineers
7 国際会議録 Three-dimensional imaging using liquid crystal grating projection (Invited Paper)

Yoshizawa, T., Fujita, H., Otani, Y., Yamamoto, M.

SPIE-The International Society for Optical Engineering
2 国際会議録 Distributed MEMS-microvalves-suitable structure for improving performances of intelligent pneumatic two-dimensional microconveyer

Chapuis, Y.-A., Fukuta, Y., Mita, Y., Fujita, H.

SPIE - The International Society of Optical Engineering
8 国際会議録 Single vegetal cell handling and fixing in a microfluidic device

Denoual, M.J., Koh, A., Mita-Tixier, A., Fujita, H.

SPIE-The International Society for Optical Engineering
3 国際会議録 Three-dimensional micro-optical architecture for chip-level optical interconnects

Prather,D.W., Vendataraman,S., LeCompte,M.R., Bates,H., Kiamilev,F.E.

SPIE-The International Society for Optical Engineering
9 国際会議録 Integrable silicon microsystem for three-dimensional flow focusing

Luque, A., Quero, J. M., Ganan-Calvo, A. M., Esteve, J., Gonsalve, S.

SPIE - The International Society of Optical Engineering
4 国際会議録 Micro optomechanical devices for medical endoscope applications (Invited Paper) [6376-06]

Nakada, M., Chong, C., Isamoto, K., Fujita, H., Toshiyoshi, H.

SPIE - The International Society of Optical Engineering
10 国際会議録 Symmetry of Three-Dimensional Quasicrystals

Ogawa,Tohru

Trans Tech Publications
5 国際会議録 Three-dimensional radiative transfer modeling of microwave brightness temperature using TRMM PR data [5979-13]

Fujita, M., Kashiwagi, H.

SPIE - The International Society of Optical Engineering
11 国際会議録 Novel three-axis silicon probe with integrated circuit on chip for microsystem components

Nesterov, V., Pornnoppadol, P., Brand, U., Wilke, R., Schmidt, M., Buettgenbach, S.

SPIE-The International Society for Optical Engineering
6 国際会議録 Three-dimensional profilometry using hybrid grating projection

Yoshizawa,T., Takahashi,H., Yamamoto,M., Otani,Y., Fujita,H.

SPIE-The International Society for Optical Engineering
12 国際会議録 Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12