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Environmental Effects on Cu/SiO2 and Cu/Ti/SiO2 Thin Film Adhesion

著者名:
掲載資料名:
Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
563
発行年:
1999
開始ページ:
269
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994706 [155899470X]
言語:
英語
請求記号:
M23500/563
資料種別:
国際会議録

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