Mechanical Stresses in Aluminum and Copper Interconnect Lines for 0.18 ヲフm Logic Technologies
- 著者名:
- 掲載資料名:
- Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 563
- 発行年:
- 1999
- 開始ページ:
- 189
- 出版情報:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994706 [155899470X]
- 言語:
- 英語
- 請求記号:
- M23500/563
- 資料種別:
- 国際会議録
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X-ray Diffraction Determination of Texture and Stress in Damascene Fabricated Copper Interconnects
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