On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate

On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate

著者名:

掲載資料名:

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

515

発行年:

1998

開始ページ:

203

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994218 [1558994211]

言語:

英語

請求記号:

M23500/515

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019381
シリーズID:	PA00000011
会議名:	Symposium on electronic packaging materials science
回次:	10th
会議開催地:	San Francisco, CA, USA
会議開催年:	1998.04.14-1998.04.16

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