Development of Mechanical Stress in CuNi(Mn) Films During Temperature Ramping: Related Mechanisms

Development of Mechanical Stress in CuNi(Mn) Films During Temperature Ramping: Related Mechanisms

著者名:

掲載資料名:

Thin-films : stresses and mechanical properties VII : symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

505

発行年:

1998

開始ページ:

397

出版情報:

Warrendale, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994102 [1558994106]

言語:

英語

請求記号:

M23500/505

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019380
シリーズID:	PA00000011
会議名:	Symposium on thin-films-stresses and mechanical properties
回次:	7th
会議開催地:	Boston, MA, USA
会議開催年:	1997.12.01-1997.12.05

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