Effect of Via Etch Profile and Barrier Metal on Electromigration Performance of W-Filler Via Structure in TiN/AlCu/TiN Metallization
- 著者名:
Ting, Larry M. Dixit, G. Jain, M. Littau, K. A. Tran, H. Chang, M. Sinha, A. - 掲載資料名:
- Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 391
- 発行年:
- 1995
- 開始ページ:
- 453
- 出版情報:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558992948 [1558992944]
- 言語:
- 英語
- 請求記号:
- M23500/391
- 資料種別:
- 国際会議録
類似資料:
Society of Photo-optical Instrumentation Engineers |
Electrochemical Society |
MRS - Materials Research Society |
SPIE-The International Society for Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
MRS - Materials Research Society |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
Materials Research Society |