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The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects

著者名:
掲載資料名:
Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
391
発行年:
1995
開始ページ:
361
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992948 [1558992944]
言語:
英語
請求記号:
M23500/391
資料種別:
国際会議録

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