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Next Generation Solder Jetted Wafer Bumping for Very Fine Pitch FlipChip Technology Applications and Beyond

著者名:
掲載資料名:
Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3906
発行年:
1999
開始ページ:
160
終了ページ:
165
出版情報:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815585 [0930815580]
言語:
英語
請求記号:
P63600/3906
資料種別:
国際会議録

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