Improvement in diffusion barrier properties of PECVD W-N thin film by low-energy BF2+ implantation

Improvement in diffusion barrier properties of PECVD W-N thin film by low-energy BF2+ implantation

著者名:

Kim,D.J. ( Korea Institute of Science and Technology and Hanyang Univ. )
Kim,Y.T.
Park,Y.K.
Sim,H.S.
Park,J.-W.

掲載資料名:

In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3743

発行年:

1999

開始ページ:

324

終了ページ:

331

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819432230 [0819432237]

言語:

英語

請求記号:

P63600/3743

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019008
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing Technologies : In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
回次:	1999
会議開催地:	Edinburgh, Scotland
会議開催年:	1999.05.19-1999.05.21

類似資料:

1 国際会議録 Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect Kim,Y.T., Kim,D.J., Lee,S., Park,Y.K., Kim,I.-S., Park,J.-W. SPIE - The International Society for Optical Engineering	7 国際会議録 The Texture and Property of Diffusion Barrier of TiN Thin Films Sung, D. Y., Kim, I., Lee, M. G., Yang, B., Yang, J. M., Ko, J. K. Trans Tech Publications
2 国際会議録 Thermal stability of PECVD W-B-N thin film as a diffusion barrier Kim,Y.T., Kim,D.J., Lee,C.W., Park,J.-W. SPIE-The International Society for Optical Engineering	8 国際会議録 The Texture Effect on Diffusion Barrier Property on TiN Films between Copper and Si Wafer Sung, D. Y., Kim, I., Lee, M. G., Park, N. J., Yang, B., Yang, J. M., Ko, J. K. Trans Tech Publications
3 国際会議録 Effect of NH3 Plasma Treatment on Improvement of Reliability of Cu/W-B- N/HSQ Interconnect Structures Kim, D.J., Sim, H.S., Kim, Y.T., Park, J.-W. Electrochemical Society	9 国際会議録 Effect of Growth Condition on the Electrical and Magnetic Properties of Sputtered ZnCo2O4 Films Kim, H.J., Song, I.C., Sim, J.H., Kim, D.J., Ihm, Y.E., Choo, W.K. Trans Tech Publications
4 国際会議録 Nanostructured Ta-Si-N Thin Films as Diffusion Barriers between Cu and SiO2 Lai, L.W., Chang, C.C., Chen, J.S., Lin, Y.K. Electrochemical Society	10 国際会議録 Nitrogen Implantation Effects on Ultra-Thin Gate Oxide Grown on Nitrogen-Implanted Silicon Nam, I.-H., Hong, S.I., Sim, J.S., Park, B.-G., Lee, J.D., Lee, S.-W., Kang, M.-S., Kim, Y.-W., Suh, K.-P. Electrochemical Society
5 国際会議録 Characteristics of Molybdenum Nitride Thin Film by N2+ Ion Implantation Kim, D. J., Kim, I-S., Kim, Y. T., Park, J-W. MRS - Materials Research Society	11 国際会議録 PREPARATION OF PZT THIN FILMS BY ECR PECVD Kim, J. W., Kim, S. T., Chung, S. W., Shin, J. S., No, K. S., Wee, D. M., Lee, W. J. MRS - Materials Research Society
6 国際会議録 Chemical Routes to Improved Mechanical Properties of PECVD Low-k Thin Films Bilodeau, S.M., Borovik, A.S., Ebbing, A.A., Vestyck, D.J., Xu, C., Roeder, J.F., Baum, T.H. Materials Research Society	12 国際会議録 Effects of Boron on Diffusion Barrier Characteristics of PECVD W-B-N Films Kim, Dong Joon, Kim, Yong Tae, Park, Jong-Wan MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12