Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements

Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements

著者名:

Stein,D.J. ( Sandia National Labs. )
Hetherington,D.L.

掲載資料名:

In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3743

発行年:

1999

開始ページ:

112

終了ページ:

119

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819432230 [0819432237]

言語:

英語

請求記号:

P63600/3743

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019008
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing Technologies : In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
回次:	1999
会議開催地:	Edinburgh, Scotland
会議開催年:	1999.05.19-1999.05.21

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3 国際会議録 In-line monitoring of chemical-mechanical polishing processes Hetherington,D.L., Stein,D.J. SPIE - The International Society for Optical Engineering	9 国際会議録 On Discrepancies between In-situ Electrochemical Measurements and Actual Removal Rates in Tungsten CMP Tamboli, Dnyanesh, Desai, Vimal, Seal, Sudipta, Sundaram, Kalpathy B. Electrochemical Society
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