Wafer scale Integration of micro-optic and optoelectronic elements by polymer UV reaction molding

Wafer scale Integration of micro-optic and optoelectronic elements by polymer UV reaction molding

著者名:

Dannberg,P. ( Fraunhofer Institute for Applied Optics and Precision Engineering )
Bierbaum,R.
Erdmann,L.
Brauer,A.H.

掲載資料名:

Optoelectronic integrated circuits and packaging III : 28-29 January 1999, San Jose, California

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3631

発行年:

1999

開始ページ:

244

終了ページ:

251

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819431011 [081943101X]

言語:

英語

請求記号:

P63600/3631

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018998
シリーズID:	PA00000029
会議名:	Photonics West : Optoelectronic Integrated Circuits and Packaging
回次:	1999 : 3rd
会議開催地:	San Jose, CA, USA
会議開催年:	1999.01.28-1999.01.29

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