Blank Cover Image

Process margin enhancement for 0.25-ｦﾌm metal etch process

著者名:
Lee,C.Y. ( Chartered Semiconductor Manufacturing Ltd. )
Ma,W.W.
Lim,E.H.
Cheng,A.
Joy,R.
Ross,M.F.
Wong,S.S.
Marlowe,T.
さらに 3 件
掲載資料名:
Advances in resist technology and processing XVII : 28 February - 1 March 2000, Santa Clara, USA
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3999
発行年:
2000
巻:
Part2
開始ページ:
865
終了ページ:
880
出版情報:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819436177 [0819436178]
言語:
英語
請求記号:
P63600/3999
資料種別:
国際会議録

類似資料:

1 国際会議録 Critical structure characterization in 0.25-ｦﾌm metal masking

Lee,C.Y., Ma,W.W., Sajan,M.R., Cheng,A.

SPIE - The International Society for Optical Engineering
7 国際会議録 Merged 2.5-V and 3.3-V 0.25-ｦﾌm CMOS technology

Kizilyalli,I.C., Huang,R.Y., Hwang,D., Kane,B.C., Ashton,R., Kuehne,S., Deng,X., Twiford,M.S., Martin,E.P., …

SPIE-The International Society for Optical Engineering
2 国際会議録 Characterization of gate electrode etch process for 0.25 ｦﾌm extended to 0.18 ｦﾌm

Gerung,H., Chhagan,V.K., Yelehanka,P.R., Zhou,M.S., Hui,J.K.L.

SPIE - The International Society for Optical Engineering
8 国際会議録 Comparative study of resist stabilization techniques for metal etch processing

Becker, G., Ross, M. F., Wong, S. S., Minter, J. P., Marlowe, T., Livesay, W. R.

SPIE - The International Society of Optical Engineering
3 国際会議録 Silicide Contacts for Sub-0.25 ｦﾌm Devices

Chen, L. J., Cheng, S. L., Chang, S. M., Peng, Y. C., Huang, H. Y., Cheng, L. W.

MRS - Materials Research Society
9 国際会議録 Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology

Venkatraman, R., Jain, A., Farkas, J., Mendonca, J., Hamilton, G., Capasso, C., Denning, D., Simpson, C., Rogers, B., …

MRS - Materials Research Society
4 国際会議録 Application of deep-UV resist for 0.25-ｦﾌm metal and poly processing

Krisa,W.L., Progler,C.J., Brennan,K., Schell,J.C.

SPIE-The International Society for Optical Engineering
10 国際会議録 Process optimization by reducing I-D bias for 0.25-ｦﾌm logic devices

Park,K.-Y., Choi,B.-I., Lee,W.-G., Ko,C.-G.

SPIE-The International Society for Optical Engineering
5 国際会議録 0.25-ｦﾌm multilevel interconnect with DUV processing

Krisa,W.L., Shaw,S.Y., Brennan,K., Dixit,G.A., Jain,M.K.

SPIE-The International Society for Optical Engineering
11 国際会議録 Plasma etch of AZ5206/Cr and ZEP7000/Cr for 0.18- to 0.25-ｦﾌm-generation advanced mask fabrication

Tsai,W., Chen,F., Kamna,M., Chegwidden,S., Labovitz,S.M., Farnsworth,J.N., Dao,G.T.

SPIE-The International Society for Optical Engineering
6 国際会議録 Optical proximity correction considering mask manufacturability and its application to 0.25-ｦﾌm DRAM for enhanced device performance

Park,C.-H., Rhie,S.-U., Choi,J.-H., Park,J.-S., Seo,H.-W., Kim,Y.-H., Park,Y.-K., Han,W.-S., Lee,W.-S., Kong,J.-T.

SPIE - The International Society for Optical Engineering
12 国際会議録 Improved Al-Via Fill Process Technology for Sub-0.25 ｦﾌm Interconnect

Sengupta, S. S., Narasimhan, M., Lee, S., Abburi, M., Yao, G.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12