Blank Cover Image

Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications

著者名:
掲載資料名:
III-V and IV-IV materials and processing challenges for highly integrated microelectronics and optoelectronics : symposium held November 30-December 3, 1998, Boston, Massachusetts, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
535
発行年:
1999
開始ページ:
165
出版情報:
Warrendale, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994416 [1558994416]
言語:
英語
請求記号:
M23500/535
資料種別:
国際会議録

類似資料:

1 国際会議録 The Effects of Environment and Fatigue on the Adhesion and Subcritical Debonding of Dielectric Polymers

Bravman, J. C., Dauskardt, R. ti., Pantelidis, D., Snodgrass, J. M.

Materials Research Society
7 国際会議録 Effect of Surface Roughness on the Adhesion of Silicon Wafers Prior to Bonding

Lee, D.H., Berby, B.

Electrochemical Society
2 国際会議録 Chemical and Structural Characterization of Silane Adhesion Promoting Films for Use in Microelectronic Packaging

Jenkins, Maura L., Snodgrass, Jeffrey, Dauskardt, Reinhold H., Bravman, John C.

Materials Research Society
8 国際会議録 THIN FILM ADHESION STUDY IN MICROELECTRONIC PACKAGING

Jeong, H. S., Freiler, Chu M. B., Durning, C., White, R. C.

Materials Research Society
3 国際会議録 Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging

Snodgrass, J. M., Hotchkiss, G., Dauskardt, R. H.

MRS - Materials Research Society
9 国際会議録 Application of computer tomography in microelectronic packaging

Speck, M., Wolter, K.-J., Daniel, D., Danczak, M.

SPIE - The International Society of Optical Engineering
4 国際会議録 Study of Crack propagation at an oxide/polymer interface under varying loading conditions

Pantelidis, Dimitrios, Snodgrass, Jeffrey, Dauskardt, Reinhold H., Bravman, John C.

MRS-Materials Research Society
10 国際会議録 EFFECT OF THERMAL DEGRADATION ON THE ADHESION OF POLYIMIDE/SILICON INTERFACE

Chu, Y.Z., Durning, C.J.

Materials Research Society
5 国際会議録 Studies of Silane Adhesion Promoters on Silica Filler Particles for Use in Microelectronic Packaging

Jenkins, Maura, DeVries, Gretchen, Dauskardt, Reinhold H., Bravman, John C.

Materials Research Society
11 国際会議録 Polyimide Coatings for Microelectronic Applications

Lee, Y. K., Craig, J. D.

American Chemical Society
6 国際会議録 Effect of Ion Enery and Dose on the Diffusion of Silicon Implanted into Gallium Arsenide

C. C. Lee, M. D. Deal, J. C. Bravman

Electrochemical Society
12 国際会議録 Measurements of the adhesion strength of Cu/epoxy interfaces

Lee, H. Y., Yu, Jin

MRS-Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12