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Copper Metallization Layers on Bismuth-Telluride Substrates: Effectiveness of Cr, Pt, and Ta40Si14N46 Thin Films As Diffusion Barriers

著者名:
掲載資料名:
Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
514
発行年:
1998
開始ページ:
537
出版情報:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994201 [1558994203]
言語:
英語
請求記号:
M23500/514
資料種別:
国際会議録

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