Blank Cover Image

Copper ULSI Interconnect Technology

著者名:
Edelstein, D.  
掲載資料名:
Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
514
発行年:
1998
開始ページ:
39
出版情報:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994201 [1558994203]
言語:
英語
請求記号:
M23500/514
資料種別:
国際会議録

類似資料:

1 国際会議録 Copper chip technology

Edelstein,D.C.

SPIE-The International Society for Optical Engineering

Dubin, V. M., Lopatin, S., Chen, S., Cheung, R., Ryu, C., Wong, S. S.

MRS - Materials Research Society

2 国際会議録 Copper chip technology

Edelstein,D.C.

SPIE-The International Society for Optical Engineering

Rathore, H.S., Nguyen, D.B., Agarwala, B., Wachnik, R.A., Procter, R.W.

Electrochemical Society

3 国際会議録 Copper chip technology

Edelstein,D.C.

SPIE-The International Society for Optical Engineering

Chung, D., Cooney, E., III., Cole, W., Locke, P., Luce, S., Megivern, C., Wachnik, R., Walton, E.

Electrochemical Society

4 国際会議録 Copper chip technology

Edelstein,D.C.

SPIE-The International Society for Optical Engineering

Ting, C.H., Zhu, M., Papapanayiotou, D., Ivanov, I.

Electrochemical Society

5 国際会議録 Copper chip technology

Edelstein,D.C.

SPIE-The International Society for Optical Engineering

Shacham-Diamand, Y.

Electrochemical Society

Grill, A., Patel, V., Saenger, K. L., Jahnes, C., Cohen, S. A., Schrott, A. G., Edelstein, D. C., Paraszczak, J. R.

MRS - Materials Research Society

H. Zeng, C. Lv, Y. Gao, T.Y. Dong, Y.H. Wang

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12