PLANARIZATION ABILITY OF CHEMICAL MECHANICAL PLANARIZATION (CMP) PROCESSES
- 著者名:
- 掲載資料名:
- Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 337
- 発行年:
- 1994
- 開始ページ:
- 151
- 出版情報:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558992375 [1558992375]
- 言語:
- 英語
- 請求記号:
- M23500/337
- 資料種別:
- 国際会議録
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3
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EFFECT OF POLISHING PAD MATERIAL PROPERTIES ON CHEMICAL MECHANICAL POLISHING (CMP) PROCESSES
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