Development of a Notebook PC Housing by Using MMSH (Momentary Mold Surface Heating) Process

Development of a Notebook PC Housing by Using MMSH (Momentary Mold Surface Heating) Process

著者名:

Kim, D. -H. ( Soonchunhyang University )
Kang, M. -H. ( NADA Innovation )
Chun, Y. H. ( Kumho Chemical Inc. )

掲載資料名:

ANTEC 2001, conference proceedings, Dallas, Texas, May 6-10

シリーズ名:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

シリーズ巻号:

47

発行年:

2001

パート:

3

開始ページ:

3347

終了ページ:

3350

総ページ数:

4

出版情報:

Brookfield Center, CT: Society of Plastics Engineers

ISBN:

9781587160981 [1587160986]

言語:

英語

請求記号:

S42700/47

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017839
シリーズID:	PA00000030
会議名:	ANTEC 2001
回次:	2001
会議開催地:	Dallas, TX, USA
会議開催年:	2001.05.06-2001.05.10

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1 国際会議録 Development of a Notebook PC Housing by Using MMSH (Momentary Mold Surface Heating)Process Kim, D. -H., Kang, M. -H., Chun, Y. H. Society of Plastics Engineers	7 国際会議録 Development of Rapid Heating and Cooling Mold Inserts Comprising a heating Layer, an Insulation Layer and a Substrate Yao, D., Chen, M., Kim, B. Society of Plastics Engineers
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