The Challenge and Methods of TEM Cross-Sectioning of <0.25-Micron Plugs
- 著者名:
- 掲載資料名:
- Electron microscopy of semiconducting materials and ULSI devices : symposium held Aprl 15-16, 1998, San Francisco, California, U. S. A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 523
- 発行年:
- 1998
- 開始ページ:
- 57
- 出版情報:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994294 [1558994297]
- 言語:
- 英語
- 請求記号:
- M23500/523
- 資料種別:
- 国際会議録
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11
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Seed-Layer Deposition For Sub 0.25 Micron Cu Metallization Using A Line Cusp Magnetron Plasma Source
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