Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability

Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability

著者名:

Bassman, L. C.

掲載資料名:

Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

473

発行年:

1997

開始ページ:

323

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993778 [1558993770]

言語:

英語

請求記号:

M23500/473

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018453
シリーズID:	PA00000011
会議名:	Symposium on materials reliability in microelectronics
回次:	7th
会議開催地:	San Francisco, CA, USA
会議開催年:	1997.04.08-1997.04.12

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