Modeling the Mechanisms of Cu-Enhanced Median Time to Failure in Al-Cu Interconnects Under Electromigration

Modeling the Mechanisms of Cu-Enhanced Median Time to Failure in Al-Cu Interconnects Under Electromigration

著者名:

掲載資料名:

Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

473

発行年:

1997

開始ページ:

317

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993778 [1558993770]

言語:

英語

請求記号:

M23500/473

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018453
シリーズID:	PA00000011
会議名:	Symposium on materials reliability in microelectronics
回次:	7th
会議開催地:	San Francisco, CA, USA
会議開催年:	1997.04.08-1997.04.12

類似資料:

1 国際会議録 Direct Correlation Between Grain Configuration and Electromigration Damage Development Shih, W. C., Ghiti, A., Low, K. S., Greer, A. L., O'Neill, A. G., Walker, J. F. MRS - Materials Research Society	7 国際会議録 A MICROSCOPICAL AND STATISTICAL STUDY OF ELECTROMIGRATION DAMAGE AND FAILURE IN A1-4wt%Cu TRACKS Shih, W. C., Denton, T. C., Greer, A. L. Materials Research Society
2 国際会議録 Analysis of Geometrical and Microstructural Effects on Void Formation in Metallization: Observation and Modelling Shih, W. C., Ghiti, A., Low, K. S., Greer, A. L., O'Neill, A. G., Walker, J. F. MRS - Materials Research Society	8 国際会議録 Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration Wolfer, W. G., Bartelt, M. C., Dike, J. J., Hoyt, J. J., Gleixner, R. J., Nix, W. D. MRS - Materials Research Society
3 国際会議録 Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects Shih, W. C., Greer, A. L. MRS - Materials Research Society	9 国際会議録 Reliability Studies of Cu Using Wafer Level Joule Heated Electromigration Test Low, K. S., Hans, P., O'Neill, A. MRS - Materials Research Society
4 国際会議録 IN-SITU ELECTROMIGRATION STRESSING IN TRANSMISSION ELECTRON MICROSCOPY FOR Al-Cu INTERCONNECTS Shih, W. C., Greer, A. L. MRS - Materials Research Society	10 国際会議録 Stress Voiding and Electromigration Failure in Multilevel Interconnect Metallization Ho, P.S., Anderson, S.G.H., Yeo, I.S., Hu, C.K. Electrochemical Society
5 国際会議録 MICROSTRUCTURE, DAMAGE AND RESISTANCE DURING ELECTROMIGRATION LIFE-TESTING OF Al-Cu INTERCONNECTS Shih, W. C., Greer, A. L., Xu, Y. Z., Jones, B. K. MRS - Materials Research Society	11 国際会議録 Electromigration failure modes and Blech effect in single-inlaid Cu interconnects Thrasher,S., Capasso,C., Zhao,L., Hernandez,R., Mulski,P., Rose,S., Nguyen,T., Kawasaki,H. SPIE-The International Society for Optical Engineering
6 国際会議録 *MICROSTRUCTURE AND THE DEVELOPMENT OF ELECTROMIGRATION DAMAGE IN NARROW INTERCONNECTS Greer, A. L., Shih, W. C. Materials Research Society	12 国際会議録 Effects of Cu and Si Dopants on Electromigration Mass Transport in Al Interconnects for VLSI Lee, C. H., Fejes, P. L., York, B. R., Elwell, S. A., Carnes, R. O., Lee, J. Y., Grivna, G. M., Bauguess, S. W., Dreyer, … MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12