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The Effect of Grain Boundaries on Surface Diffusion Mediated-Planarization of Polycrystalline Cu Films

著者名:
掲載資料名:
Modeling and simulation of thin-film processing : symposium held April 17-20, 1995, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
389
発行年:
1995
開始ページ:
107
出版情報:
Pittsburgh: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992924 [1558992928]
言語:
英語
請求記号:
M23500/389
資料種別:
国際会議録

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