A FINE-PITCH LEADLESS CHIP ASSEMBLY TECHNOLOGY WITH THE BUILT-UP PCB

A FINE-PITCH LEADLESS CHIP ASSEMBLY TECHNOLOGY WITH THE BUILT-UP PCB

著者名:

Tanaka,Kei ( NEC Corporation )

掲載資料名:

1996 International Conference on Multichip Modules : proceedings, April 17-19, 1996, Denver, Colorado

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

2794

発行年:

1996

開始ページ:

369

終了ページ:

374

出版情報:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815479 [0930815475]

言語:

英語

請求記号:

P63600/2794

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018414
シリーズID:	PA00000029
会議名:	International Conference on Multichip Modules
回次:	1996
会議開催地:	Denver, CO, USA
会議開催年:	1996.04.17-1996.04.19

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