Minimize Part Warpage by Integrated CAE Technology

Minimize Part Warpage by Integrated CAE Technology

著者名:

Chang -Y. R. ( National Tsing-Hua University )
Chen -C. Y. ( National Tsing-Hua University )
Hsu -H. C. ( CoreTech System Co., Ltd. )
Tsai -H. M.

掲載資料名:

Conference proceedings at ANTEC '98 : plastics on my mind, Society of Plastics Engineers, Atlanta, Georgia, April 26-April 30, 1998

シリーズ名:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

シリーズ巻号:

44(1)

発行年:

1998

巻:

1

開始ページ:

903

終了ページ:

907

総ページ数:

5

出版情報:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

ISBN:

9781566766692 [1566766699]

言語:

英語

請求記号:

S42700/44-1

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018301
シリーズID:	PA00000030
会議名:	ANTEC '98 : Annual Technical Conference
回次:	56th
会議開催地:	Atlanta, GA, USA
会議開催年:	1998.04.26-1998.04.30
論文注記:	BLOW MOLDING DIVISION

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