Step and stamp imprint lithography using a commercial flip chip bonder

Step and stamp imprint lithography using a commercial flip chip bonder

著者名:

掲載資料名:

Emerging lithographic technologies IV : 28 February-1 March 2000, Santa Clara, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3997

発行年:

2000

開始ページ:

874

終了ページ:

880

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819436153 [0819436151]

言語:

英語

請求記号:

P63600/3997

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018055
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Emerging lithographic technologies
回次:	2000 : 4th
会議開催地:	Santa Clara, CA, USA
会議開催年:	2000.02.28-2000.03.01

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