Angle-resolved XPS studies of interfacial bonding states in silicon oxynitrides fabricated using different thermal methodologies

Angle-resolved XPS studies of interfacial bonding states in silicon oxynitrides fabricated using different thermal methodologies

著者名:

掲載資料名:

Interfacial engineering for optimized properties II : symposium held December 1-2, 1999, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

586

発行年:

2000

開始ページ:

99

出版情報:

Warrendale, Pa.: MRS-Materials Research Society

ISSN:

02729172

ISBN:

9781558994942 [1558994947]

言語:

英語

請求記号:

M23500/586

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018051
シリーズID:	PA00000011
会議名:	Interfacial Engineering for Optimized Properties : Symposium
回次:	2nd
会議開催地:	Boston, MA, USA
会議開催年:	1999.12.01-1999.12.02

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