Challenges of damascene etching for copper interconnect

Challenges of damascene etching for copper interconnect

著者名:

Ho,P.K.K. ( Chartered Semiconductor Manufacturing Ltd. )

掲載資料名:

Multilevel Interconnect Technology III

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3883

発行年:

1999

開始ページ:

34

終了ページ:

41

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434807 [0819434809]

言語:

英語

請求記号:

P63600/3883

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017633
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing : Multilevel Interconnect Technology
回次:	1999 : 3rd
会議開催地:	Santa Clara, CA, USA
会議開催年:	1999.09.22-1999.09.23

類似資料:

1 国際会議録 Copper Electroplating for Damascene ULSI Interconnects Dubin, V. M., Lopatin, S., Chen, S., Cheung, R., Ryu, C., Wong, S. S. MRS - Materials Research Society	7 国際会議録 Localized Measurement Of Strains In Damascene Copper Interconnects By Convergent-Beam Electron Diffraction Nucci, J.A., Keller, R.R., Kraemer, S., Volkert, C.A., Gross, M.E. Materials Research Society
2 国際会議録 Length Effects On The Reliability Of Dual-Damascene Cu Interconnects Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., … Materials Research Society	8 国際会議録 Texture Investigations In Damascene Copper Interconnects Mirpuri, K., Szpunar, J.A., Kozaczek, K. Trans Tech Publications
3 国際会議録 Microtexture And Strain In Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	9 国際会議録 High Density Plasma Silicon Carbide As A Barrier/Etch Stop Film For Copper Damascene Interconnects M'Saad, H., Cho, S., Vellaikal, M., Li, Z. Materials Research Society
4 国際会議録 Microtexture and Strain in Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	10 国際会議録 Current Challenges with Copper Interconnects P.R. Besser Electrochemical Society
5 国際会議録 Copper metallization for on-chip interconnects Gelatos,A.V., Nguyen,B.-Y., Perry,K.A., Marsh,R., Peschke,J., Filipiak,S., Travis,E.O., Thompson,M.A., Saaranen,T., … SPIE-The International Society for Optical Engineering	11 国際会議録 Planarization of Copper Damascene Interconnects by Spin-Etch Process: A Chemical Approach Mukherjee, S.P., Levert, J.A., DeBear, D.S. Materials Research Society
6 国際会議録 Slurries for Copper Damascene Patterning: Similarities and Differences Jindal, A., Rajagopalan, G., Gupta, M., Lu, J. -Q., Rose, K., Gutmann, R. J. Materials Research Society	12 国際会議録 Electroless Copper Deposition on Ruthenium for Damascene Interconnects Q. Chen, X. Lin, C. Valvede, V. Paneccasio, R. Hurtubise Electrochemical Society

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