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RTP Based TiN Barrier Integrity for WF6 Processing During W-Plug Formation

著者名:
Lee, C. Y.
Yen, H.
Hsia, S. T.
Liu, D.
Shah, N.
Feldmeier, K.
Wasserman, Y.
さらに 2 件
掲載資料名:
Rapid thermal and integrated processing IV : symposium held April 17-20, 1995, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
387
発行年:
1995
開始ページ:
383
出版情報:
Pittsburgh, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992900 [1558992901]
言語:
英語
請求記号:
M23500/387
資料種別:
国際会議録

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