MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging
- 著者名:
Bristow,J.P. ( Honeywell Technology Ctr. ) Liu,Y. Marta,T. Johnson,K. Hanzal,B.R. Peczalski,A. Bounnak,S. Liu,Y.S. Cole,H.S. - 掲載資料名:
- Optoelectronic Packaging
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 2691
- 発行年:
- 1996
- 開始ページ:
- 18
- 終了ページ:
- 24
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819420657 [0819420654]
- 言語:
- 英語
- 請求記号:
- P63600/2691
- 資料種別:
- 国際会議録
類似資料:
1
国際会議録
Polymer optical waveguide technology for multichip modules(MCMs)and board-level interconnects
SPIE-The International Society for Optical Engineering |
Materials Research Society |
Society of Photo-optical Instrumentation Engineers |
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Materials Research Society |