Triple Junction Structure and Properties
- 著者名:
- King,A.H.
- 掲載資料名:
- Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998
- シリーズ名:
- Materials science forum
- シリーズ巻号:
- 294-296
- 発行年:
- 1999
- 開始ページ:
- 91
- 終了ページ:
- 94
- 出版情報:
- Zurich-Uetikon, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- ISBN:
- 9780878498239 [0878498230]
- 言語:
- 英語
- 請求記号:
- M23650
- 資料種別:
- 国際会議録
類似資料:
Trans Tech Publications |
7
国際会議録
TEM Investigations of Grain Boundary Fracture and its Interaction with Grain Boundary Structure
Trans Tech Publications |
2
国際会議録
Triple junction engineering: The distribution of triple junctions in polycrystalline gold thin films
MRS-Materials Research Society |
8
国際会議録
INTERACTION OF SLIP WITH GRAIN BOUNDARY IN THE L12 ORDERED STRUCTURE - A Σ = 9 TILT BOUNDARY
Materials Research Society |
Materials Research Society |
Trans Tech Publications |
4
国際会議録
The Influence of Anisotropic Grain Boundary Energy on Triple Junction Morphology and Grain Growth
MRS - Materials Research Society |
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |
Materials Research Society |
Trans Tech Publications |